The Center for Quantum Devices Facilities by    
Page 4 of 7:  Prev << 1 2 3 4  5 6 7  >> Next  (63 Items)

UV Photoluminescence
UV Photoluminescence
Three UV lasers (193 nm Excimer, 244 nm Fred Argon-Ion, and 325 nm HeCd), monochromatoer, electronics, and computer system used to charicterize III-Nitride materials.
 
UV Device Charicterization
UV Device Charicterization
Probe-station and electronics used to characterize APDs, LEDs, and other uncooled III-Nitride devices.
 
Dicing System
Dicing System
This K&S 7100 semi-automatic dicing system is used in the partition of wafers into smaller die.
 
Life testing System
Life testing System
Life testing system allows for extended logging and testing of lasers and LEDs at controlled currents, voltages, or output powers, at a constant temperature.
 
Scribing Machine
Scribing Machine
Lomis scribe and break machine used to cleave wafers.
 
Camera System
Camera System
Electronics head and LN2 Dewar of the SE-IR camera system used to operate FPAs and perform array characterization.
 
EDX
EDX
Hitachi S4500 Cold field emission scanning electron microscope (SEM) with an Oxford EDX detector for elemental analysis.
 
SE-IR Camera System
SE-IR Camera System
New SE-IR camera system used to operate large format and two-color FPAs with lower noise and higher frame rates.
 
Wire Bonder
Wire Bonder
SUSS wire bonder used to perform gold wedge and ball bonding in order to make electrical contact to discreet devices.
 
MOCVD Reactor
MOCVD Reactor
This is the MOCVD reactor developed by Professor Razerghi at Thompson and brought with her to northwestern.
 

Page 4 of 7:  Prev << 1 2 3 4  5 6 7  >> Next  (63 Items)