UV Device Charicterization
Probe-station and electronics used to characterize APDs, LEDs, and other uncooled III-Nitride devices.
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Dicing System
This K&S 7100 semi-automatic dicing system is used in the partition of wafers into smaller die.
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Life testing System
Life testing system allows for extended logging and testing of lasers and LEDs at controlled currents, voltages, or output powers, at a constant temperature.
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Scribing Machine
Lomis scribe and break machine used to cleave wafers.
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Camera System
Electronics head and LN2 Dewar of the SE-IR camera system used to operate FPAs and perform array characterization.
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EDX
Hitachi S4500 Cold field emission scanning electron microscope (SEM) with an Oxford EDX detector for elemental analysis.
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MOCVD Reactor
This is the MOCVD reactor developed by Professor Razerghi at Thompson and brought with her to northwestern.
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Toxic Gas Detection System
This is the MDA toxic gas detection system that helps ensure the safety of the labs and surrounding area.
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SEC Die Bonder
Die Bonder used to fabricate laser diodes and back emission LEDs.
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Dielectric Evaporator
CHA E-Beam Evaporator designed to evaporate various dielectrics. Has built in optical monitor to assist in fabrication of mirror and AR coatings.
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