Center for Quantum Devices - Facilities and Equipment

UV Photoluminescence Three UV lasers (193 nm Excimer, 244 nm Fred Argon-Ion, and 325 nm HeCd), monochromatoer, electronics, and computer system used to charicterize III-Nitride materials.	UV Device Charicterization Probe-station and electronics used to characterize APDs, LEDs, and other uncooled III-Nitride devices.
Dicing System This K&S 7100 semi-automatic dicing system is used in the partition of wafers into smaller die.	Life testing System Life testing system allows for extended logging and testing of lasers and LEDs at controlled currents, voltages, or output powers, at a constant temperature.
Scribing Machine Lomis scribe and break machine used to cleave wafers.	Camera System Electronics head and LN2 Dewar of the SE-IR camera system used to operate FPAs and perform array characterization.
EDX Hitachi S4500 Cold field emission scanning electron microscope (SEM) with an Oxford EDX detector for elemental analysis.	SE-IR Camera System New SE-IR camera system used to operate large format and two-color FPAs with lower noise and higher frame rates.
Wire Bonder SUSS wire bonder used to perform gold wedge and ball bonding in order to make electrical contact to discreet devices.	MOCVD Reactor This is the MOCVD reactor developed by Professor Razerghi at Thompson and brought with her to northwestern.

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