The Center for Quantum Devices Facilities by    
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Wire Bonder
Wire Bonder
Gold wire bonder used in the packaging of semiconductor devices for test.
 
Inductively Coupled Plasma (ICP) Ethcing system
Inductively Coupled Plasma (ICP) Ethcing system
Inductively coupled plasma (ICP) ethcing system used to etch high aspect ratio features in semiconductors.
 
X-ray Difractometer
X-ray Difractometer
BEDE D1 High resolution X-ray difractometer equipped with an analyzer crystal for reciprocal space mapping. This maching can also perform spatial matting of up to 4-inch wafers
 
Optical Profiler
Optical Profiler
Zygo NewView optical profiler used to create 3D surface maps of wafers
 
Metal E-beam Evaporator
Metal E-beam Evaporator
Electron-beam metal deposition system outfitted for deposition of Gold, Platinum, Titanium, and Nickel, with a secondary thermal boat for evaporation of Gold-Germanium.
 
ECR Etching System
ECR Etching System
PlasmaLabs Electron Cyclotron Resonance dry etching system used in the processing of semiconductor devices
 
PECVD System
PECVD System
Oxford Instrument Plasma Enhanced Chemical Vapor Deposition system used to deposit dielectrics such as silicon dioxide and silicon nitride used in the passivation of devices.
 
Thermal Evaporator
Thermal Evaporator
This is an extensively modified Veeco thermal evaporator that is used to deposit metals.
 
Electric Capacitance-Voltage Profiler
Electric Capacitance-Voltage Profiler
Accent Optical ECV-Pro Capacitance-Voltage profiling machine (also known as Polaron) used to charicterize the doping profile.
 
Hydrogen Generator
Hydrogen Generator
Electrolysis module used to dynamically generate all of the hydrogen used in the cleanroom facility.
 

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