| Wire Bonder
Gold wire bonder used in the packaging of semiconductor devices for test.
| Inductively Coupled Plasma (ICP) Ethcing system |
Inductively coupled plasma (ICP) ethcing system used to etch high aspect ratio features in semiconductors.
| X-ray Difractometer
BEDE D1 High resolution X-ray difractometer equipped with an analyzer crystal for reciprocal space mapping. This maching can also perform spatial matting of up to 4-inch wafers
| Optical Profiler |
Zygo NewView optical profiler used to create 3D surface maps of wafers
| Metal E-beam Evaporator
Electron-beam metal deposition system outfitted for deposition of Gold, Platinum, Titanium, and Nickel, with a secondary thermal boat for evaporation of Gold-Germanium.
| ECR Etching System |
PlasmaLabs Electron Cyclotron Resonance dry etching system used in the processing of semiconductor devices
| PECVD System
Oxford Instrument Plasma Enhanced Chemical Vapor Deposition system used to deposit dielectrics such as silicon dioxide and silicon nitride used in the passivation of devices.
| Thermal Evaporator |
This is an extensively modified Veeco thermal evaporator that is used to deposit metals.
| Electric Capacitance-Voltage Profiler
Accent Optical ECV-Pro Capacitance-Voltage profiling machine (also known as Polaron) used to charicterize the doping profile.
| Hydrogen Generator |
Electrolysis module used to dynamically generate all of the hydrogen used in the cleanroom facility.