Center for Quantum Devices - Facilities and Equipment

Wire Bonder Gold wire bonder used in the packaging of semiconductor devices for test.	Inductively Coupled Plasma (ICP) Ethcing system Inductively coupled plasma (ICP) ethcing system used to etch high aspect ratio features in semiconductors.
X-ray Difractometer $X-ray Difractometer$ BEDE D1 High resolution X-ray difractometer equipped with an analyzer crystal for reciprocal space mapping. This maching can also perform spatial matting of up to 4-inch wafers	Optical Profiler Zygo NewView optical profiler used to create 3D surface maps of wafers
Metal E-beam Evaporator Electron-beam metal deposition system outfitted for deposition of Gold, Platinum, Titanium, and Nickel, with a secondary thermal boat for evaporation of Gold-Germanium.	ECR Etching System PlasmaLabs Electron Cyclotron Resonance dry etching system used in the processing of semiconductor devices
PECVD System Oxford Instrument Plasma Enhanced Chemical Vapor Deposition system used to deposit dielectrics such as silicon dioxide and silicon nitride used in the passivation of devices.	Thermal Evaporator This is an extensively modified Veeco thermal evaporator that is used to deposit metals.
Electric Capacitance-Voltage Profiler Accent Optical ECV-Pro Capacitance-Voltage profiling machine (also known as Polaron) used to charicterize the doping profile.	Hydrogen Generator Electrolysis module used to dynamically generate all of the hydrogen used in the cleanroom facility.

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