| Electron Beam Lithography
Lica Lion-LV1 electron beam lithography system capable or producing features smaller than 30 nm.
| Laser Measurement Setup |
Bruker FRIR, laser drivers, thermostatic stage, and data acquisition equipment
| Photodetector Measurment Setup
Burker FTIR and Helium cryostat used to characterize Infrared materials and devices.
| Lapping & Polishing |
One of two Logitech lapping and polsihing systems used to mechanically thin laser diodes in preperatiion for cleaving, or to assist in back-thinning of hybridized focal plane arrays for higher performance.
| Laser Bonder
SET FC-150 high-precision die-bonder used to bond lasers with excellent placement accuracy and planarity.
| Atomic Force Microscope |
Digital Instruments, Nanoscope D3100 scanning probe microscope in a vibration isolation enclosure, configured for tapping more AFM.
| IR Photoluminescence
Setup used to characterize IR material using an argon-ion laser, monochromator, lock-in amplifier, and various commercial IR detectors.
| Scanning Electron Microscope |
Hitachi 4500 cold field emission SEM used in the characterization of epitaxial films and the processing of semiconductor devices.
| High-Resolution X-Ray Diffraction System
Philips HR-XRD with a 2 KW copper Kα source, 4-bounce germanium monochromator, precision goniometer, and scintillation detector.
| Chemistry Room |
Class 1000 chemistry room with four hoods, mask aligner, and yellow lighting to support lithography and semiconductor device processing.