Publications by    
Page 1  (19 Items)

1.  
Engineering future light emitting diodes and photovoltaics with inexpensive materials: Integrating ZnO and Si into GaN-based devices
Engineering future light emitting diodes and photovoltaics with inexpensive materials: Integrating ZnO and Si into GaN-based devices
C. Bayram ; K. T. Shiu ; Y. Zhu ; C. W. Cheng ; D. K. Sadana ; F. H. Teherani ; D. J. Rogers ; V. E. Sandana ; P. Bove ; Y. Zhang ; S. Gautier ; C.-Y. Cho ; E. Cicek ; Z. Vashaei ; R. McClintock ; M. Razeghi
Proc. SPIE 8626, Oxide-based Materials and Devices IV, 86260L (March 18, 2013)-- March 18, 2013
Indium Gallium Nitride (InGaN) based PV have the best fit to the solar spectrum of any alloy system and emerging LED lighting based on InGaN technology and has the potential to reduce energy consumption by nearly one half while enabling significant carbon emission reduction. However, getting the maximum benefit from GaN diode -based PV and LEDs will require wide-scale adoption. A key bottleneck for this is the device cost, which is currently dominated by the substrate (i.e. sapphire) and the epitaxy (i.e. GaN). This work investigates two schemes for reducing such costs. First, we investigated the integration of Zinc Oxide (ZnO) in InGaN-based diodes. (Successful growth of GaN on ZnO template layers (on sapphire) was illustrated. These templates can then be used as sacrificial release layers for chemical lift-off. Such an approach provides an alternative to laser lift-off for the transfer of GaN to substrates with a superior cost-performance profile, plus an added advantage of reclaiming the expensive single-crystal sapphire. It was also illustrated that substitution of low temperature n-type ZnO for n-GaN layers can combat indium leakage from InGaN quantum well active layers in inverted p-n junction structures. The ZnO overlayers can also double as transparent contacts with a nanostructured surface which enhances light in/out coupling. Thus ZnO was confirmed to be an effective GaN substitute which offers added flexibility in device design and can be used in order to simultaneously reduce the epitaxial cost and boost the device performance. Second, we investigated the use of GaN templates on patterned Silicon (100) substrates for reduced substrate cost LED applications. Controlled local metal organic chemical vapor deposition epitaxy of cubic phase GaN with on-axis Si(100) substrates was illustrated. Scanning electron microscopy and transmission electron microscopy techniques were used to investigate uniformity and examine the defect structure in the GaN. Our results suggest that groove structures are very promising for controlled local epitaxy of cubic phase GaN. Overall, it is concluded that there are significant opportunities for cost reduction in novel hybrid diodes based on ZnO-InGaN-Si hybridization. reprint
 
2.  
Crack-free AlGaN for solar-blind focal plane arrays through reduced area expitaxy
Crack-free AlGaN for solar-blind focal plane arrays through reduced area expitaxy
E. Cicek, R. McClintock, Z. Vashaei, Y. Zhang, S. Gautier, C.Y. Cho and M. Razeghi
Applied Physics Letters, Vol. 102, No. 05, p. 051102-1-- February 4, 2013
We report on crack reduction for solar-blind ultraviolet detectors via the use of a reduced area epitaxy (RAE) method to regrow on patterned AlN templates. With the RAE method, a pre-deposited AlN template is patterned into isolated mesas in order to reduce the formation of cracks in the subsequently grown high Al-content AlxGa1−xN structure. By restricting the lateral dimensions of the epitaxial growth area, the biaxial strain is relaxed by the edges of the patterned squares, which resulted in ∼97% of the pixels being crack-free. After successful implementation of RAE method, we studied the optical characteristics, the external quantum efficiency, and responsivity of average pixel-sized detectors of the patterned sample increased from 38% and 86.2 mA/W to 57% and 129.4 mA/W, respectively, as the reverse bias is increased from 0 V to 5 V. Finally, we discussed the possibility of extending this approach for focal plane array, where crack-free large area material is necessary for high quality imaging. reprint
 
3.  
Gallium nitride on silicon for consumer & scalable photonics
Gallium nitride on silicon for consumer & scalable photonics
C. Bayram, K.T. Shiu, Y. Zhu, C.W. Cheng, D.K. Sadana, Z. Vashaei, E. Cicek, R. McClintock and M. Razeghi
SPIE Proceedings, Vol. 8631, p. 863112-1, Photonics West, San Francisco, CA-- February 4, 2013
Gallium Nitride (GaN) is a unique material system that has been heavily exploited for photonic devices thanks to ultraviolet-to-terahertz spectral tunability. However, without a cost effective approach, GaN technology is limited to laboratory demonstrations and niche applications. In this investigation, integration of GaN on Silicon (100) substrates is attempted to enable widespread application of GaN based optoelectronics. Controlled local epitaxy of wurtzite phase GaN on on-axis Si(100) substrates is demonstrated via metal organic chemical vapor deposition (MOCVD). CMOS-compatible fabrication scheme is used to realize [SiO2-Si{111}-Si{100}] groove structures on conventional 200-mm Si(100) substrates. MOCVD growth (surface treatment, nucleation, initiation) conditions are studied to achieve controlled GaN epitaxy on such grooved Si(100) substrates. Scanning electron microscopy and transmission electron microscopy techniques are used to determine uniformity and defectivity of the GaN. Our results show that aforementioned groove structures along with optimized MOCVD growth conditions can be used to achieve controlled local epitaxy of wurtzite phase GaN on on-axis Si(100) substrates. reprint
 
4.  
Near milliwatt power AlGaN-based ultraviolet light emitting diodes based on lateral epitaxial overgrowth of AlN on Si(111)
Near milliwatt power AlGaN-based ultraviolet light emitting diodes based on lateral epitaxial overgrowth of AlN on Si(111)
Y. Zhang, S. Gautier, C. Cho, E. Cicek, Z, Vashaei, R. McClintock, C. Bayram, Y. Bai and M. Razeghi
Applied Physics Letters, Vol. 102, No. 1, p. 011106-1-- January 7, 2013
We report on the growth, fabrication, and device characterization of AlGaN-based thin-film ultraviolet (UV) (λ ∼ 359 nm) light emitting diodes (LEDs). First, AlN/Si(111) template is patterned. Then, a fully coalesced 7-μm-thick lateral epitaxial overgrowth (LEO) of AlN layer is realized on patterned AlN/Si(111) template followed by UV LED epi-regrowth. Metalorganic chemical vapor deposition is employed to optimize LEO AlN and UV LED epitaxy. Back-emission UV LEDs are fabricated and flip-chip bonded to AlN heat sinks followed by Si(111) substrate removal. A peak pulsed power and slope efficiency of ∼0.6 mW and ∼1.3 μW/mA are demonstrated from these thin-film UV LEDs, respectively. For comparison, top-emission UV LEDs are fabricated and back-emission LEDs are shown to extract 50% more light than top-emission ones. reprint
 
5.  
Temperature dependence of the dark current and activation energy at avalanche onset of GaN Avalanche Photodiodes
Temperature dependence of the dark current and activation energy at avalanche onset of GaN Avalanche Photodiodes
M.P. Ulmer, E. Cicek, R. McClintock, Z. Vashaei and M. Razeghi
SPIE Proceedings, Vol. 8460, p. 84601G-1-- August 15, 2012
We report a study of the performance of an avalanche photodiode (APD) as a function of temperature from 564 K to 74 K. The dark current at avalanche onset decreases from 564 K to 74 K by approximately a factor of 125 and from 300 K to 74K the dark current at avalanche offset is reduced by a factor of about 10. The drop would have been considerably larger if the activation energy at avalanche onset (Ea) did not also decrease with decreasing temperature. These data give us insights into how to improve the single-photon counting performance of a GaN based ADP. reprint
 
6.  
AlGaN-based deep-ultraviolet 320 x 256 focal plane array
AlGaN-based deep-ultraviolet 320 x 256 focal plane array
E. Cicek, Z. Vashaei, E.K. Huang, R. McClintock and M. Razeghi
OSA Optics Letters, Vol. 37, No. 5, p. 896-898-- March 1, 2012
We report the synthesis, fabrication, and testing of a 320 × 256 focal plane array (FPA) of back-illuminated, solarblind, p-i-n, AlxGa1−xN–based detectors, fully realized within our research laboratory. We implemented a pulse atomic layer deposition technique for the metalorganic chemical vapor deposition growth of thick, high-quality, crack-free, high Al composition AlxGa1−xN layers. The FPA is hybridized to a matching ISC 9809 readout integrated circuit and operated in a SE-IR camera system. Solar-blind operation is observed throughout the array with peak detection occurring at wavelengths of 256 nm and lower, and falling off three orders of magnitude by ∼285 nm. By developing an opaque masking technology, the visible response of the ROIC is significantly reduced; thus the need for external filtering to achieve solar- and visible-blind operation is eliminated. This allows the FPA to achieve high external quantum efficiency (EQE); at 254 nm, average pixels showed unbiased peak responsivity of 75 mA∕W, which corresponds to an EQE of ∼37%. Finally, the uniformity of the FPA and imaging properties are investigated. reprint
 
7.  
Reliable GaN-based resonant tunneling diodes with reproducible room-temperature negative differential resistance
Reliable GaN-based resonant tunneling diodes with reproducible room-temperature negative differential resistance
C. Bayram, D.K. Sadana, Z. Vashaei and M. Razeghi
SPIE Proceedings, Vol. 8268, p. 826827-- January 22, 2012
negative differential resistance (NDR). Compared to other negative resistance devices such as (Esaki) tunnel and transferred-electron devices, RTDs operate much faster and at higher temperatures. III-nitride materials, composed of AlGaInN alloys, have wide bandgap, high carrier mobility and thermal stability; making them ideal for high power high frequency RTDs. Moreover, larger conduction band discontinuity promise higher NDR than other materials (such as GaAs) and room-temperature operation. However, earlier efforts on GaN-based RTD structures have failed to achieve a reliable and reproducible NDR. Recently, we have demonstrated for the first time that minimizing dislocation density and eliminating the piezoelectric fields enable reliable and reproducible NDR in GaN-based RTDs even at room temperature. Observation of NDR under both forward and reverse bias as well as at room and low temperatures attribute the NDR behaviour to quantum tunneling. This demonstration marks an important milestone in exploring III-nitride quantum devices, and will pave the way towards fundamental quantum transport studies as well as for high frequency optoelectronic devices such as terahertz emitters based on oscillators and cascading structures. reprint
 
8.  
Deep ultraviolet (254 nm) focal plane array
Deep ultraviolet (254 nm) focal plane array
E. Cicek, Z. Vashaei, R. McClintock, and M. Razeghi
SPIE Proceedings, Conference on Infrared Sensors, Devices and Applications; and Single Photon Imaging II, Vol. 8155, p. 81551O-1-- August 21, 2011
We report the synthesis, fabrication and testing of a 320 × 256 focal plane array (FPA) of back-illuminated, solarblind, p-i-n, AlxGa1-xN-based detectors, fully realized within our research laboratory. We implemented a novel pulsed atomic layer deposition technique for the metalorganic chemical vapor deposition (MOCVD) growth of crackfree, thick, and high Al composition AlxGa1-xN layers. Following the growth, the wafer was processed into a 320 × 256 array of 25 μm × 25 μm pixels on a 30 μm pixel-pitch and surrounding mini-arrays. A diagnostic mini-array was hybridized to a silicon fan-out chip to allow the study of electrical and optical characteristics of discrete pixels of the FPA. At a reverse bias of 1 V, an average photodetector exhibited a low dark current density of 1.12×10-8 A·cm-2. Solar-blind operation is observed throughout the array with peak detection occurring at wavelengths of 256 nm and lower and falling off three orders of magnitude by 285 nm. After indium bump deposition and dicing, the FPA is hybridized to a matching ISC 9809 readout integrated circuit (ROIC). By developing a novel masking technology, we significantly reduced the visible response of the ROIC and thus the need for external filtering to achieve solar- and visible-blind operation is eliminated. This allowed the FPA to achieve high external quantum efficiency (EQE): at 254 nm, average pixels showed unbiased peak responsivity of 75 mA/W, which corresponds to an EQE of ~37%. Finally, the uniformity of the FPA and imaging properties are investigated. reprint
 
9.  
Effects of substrate quality and orientation on the characteristics of III-nitride resonant tunneling diodes
Effects of substrate quality and orientation on the characteristics of III-nitride resonant tunneling diodes
Z. Vashaei, C. Bayram, R. McClintock and M. Razeghi
SPIE Proceedings, San Francisco, CA (January 22-27, 2011), Vol 7945, p. 79451A-- January 23, 2011
Al(Ga)N/GaN resonant tunneling diodes (RTDs) are grown by metal-organic chemical vapor deposition. The effects of material quality on room temperature negative differential resistance (NDR) behaviour of RTDs are investigated by growing the RTD structure on AlN, GaN, and lateral epitaxial overgrowth GaN templates. This reveals that NDR characteristics of RTDs are very sensitive to material quality (such as surface roughness and dislocations density). The effects of the aluminum content of AlGaN double barriers (DB) and polarization fields on NDR characteristic of AlGaN/GaN RTDs were also investigated by employing low dislocation density c-plane (polar) and m-plane (nonpolar) freestanding GaN substrates. Lower aluminum content in the DB RTD active layer and minimization of dislocations and polarization fields enabled a more reliable and reproducible NDR behaviour at room temperature. reprint
 
10.  
III-Nitride Optoelectronic Devices:  From ultraviolet detectors and visible emitters towards terahertz intersubband devices
III-Nitride Optoelectronic Devices: From ultraviolet detectors and visible emitters towards terahertz intersubband devices
M. Razeghi, C. Bayram, Z. Vashaei, E. Cicek and R. McClintock
IEEE Photonics Society 23rd Annual Meeting, November 7-10, 2010, Denver, CO, Proceedings, p. 351-352-- January 20, 2011
III-nitride optoelectronic devices are discussed. Ultraviolet detectors and visible emitters towards terahertz intersubband devices are reported. Demonstration of single photon detection efficiencies of 33% in the ultraviolet regime, intersubband energy level as low as in the mid-infrared regime, and GaN-based resonant tunneling diodes with negative resistance of 67 Ω are demonstrated. reprint
 
11.  
Reliability in room-temperature negative differential resistance characteristics of low-aluminum contact AlGaN/GaN double-barrier resonant tunneling diodes
Reliability in room-temperature negative differential resistance characteristics of low-aluminum contact AlGaN/GaN double-barrier resonant tunneling diodes
C. Bayram, Z. Vashaei, and M. Razeghi
Applied Physics Letters, Vol. 97, No. 18, p. 181109-1-- November 1, 2010
AlGaN/GaN resonant tunneling diodes (RTDs), consisting of 20% (10%) aluminum-content in double-barrier (DB) active layer, were grown by metal-organic chemical vapor deposition on freestanding polar (c-plane) and nonpolar (m-plane) GaN substrates. RTDs were fabricated into 35-μm-diameter devices for electrical characterization. Lower aluminum content in the DB active layer and minimization of dislocations and polarization fields increased the reliability and reproducibility of room-temperature negative differential resistance (NDR). Polar RTDs showed decaying NDR behavior, whereas nonpolar ones did not significantly. Averaging over 50 measurements, nonpolar RTDs demonstrated a NDR of 67 Ω, a current-peak-to-valley ratio of 1.08, and an average oscillator output power of 0.52 mW. reprint
 
12.  
Photoluminescence characteristics of polar and nonpolar AlGaN/GaN superlattices
Photoluminescence characteristics of polar and nonpolar AlGaN/GaN superlattices
Z. Vashaei, C. Bayram, P. Lavenus, and M. Razeghi
Applied Physics Letters, Vol. 97, No. 12, p. 121918-1-- September 20, 2010
High quality Al0.2Ga0.8N/GaN superlattices (SLs) with various (GaN) well widths (1.6 to 6.4 nm) have been grown on polar c-plane and nonpolar m-plane freestanding GaN substrates by metal-organic chemical vapor deposition. Atomic force microscopy, high resolution x-ray diffraction, and photoluminescence (PL) studies of SLs have been carried out to determine and correlate effects of well width and polarization field on the room-temperature PL characteristics. A theoretical model was applied to explain PL energy-dependency on well width and crystalline orientation taking into account internal electric field for polar substrate. Absence of induced-internal electric field in nonpolar SLs was confirmed by stable PL peak energy and stronger PL intensity as a function of excitation power density than polar ones. reprint
 
13.  
Room temperature neagtive differential resistance characteristics of polar III-nitride resonant tunneling diodes
Room temperature neagtive differential resistance characteristics of polar III-nitride resonant tunneling diodes
C. Bayram, Z. Vashaei, and M. Razeghi
Applied Physics Letters, Vol. 97, No. 9, p. 092104-1-- August 30, 2010
III-nitride resonant tunneling diodes (RTDs), consisting Al0.2Ga0.8N/GaN double-barrier (DB) active layers, were grown on c-plane lateral epitaxial overgrowth (LEO) GaN/sapphire and c-plane freestanding (FS) GaN. RTDs on both templates, fabricated into mesa diameters ranging from 5 to 35 μm, showed negative differential resistance (NDR) at room temperature. NDR characteristics (voltage and current density at NDR onset and current-peak-to-valley ratio) were analyzed and reported as a function of device size and substrate choice. Our results show that LEO RTDs perform as well as FS ones and DB active layer design and quality have been the bottlenecks in III-nitride RTDs. reprint
 
14.  
Comparison of ultraviolet APDs grown on free-standing GaN and sapphire substrates
Comparison of ultraviolet APDs grown on free-standing GaN and sapphire substrates
E. Cicek, Z. Vashaei, C. Bayram, R. McClintock, M. Razeghi and M. Ulmer
Proceedings, Vol. 7780, p. 77801P, SPIE Optics and Photonics Symposium, Conference on Detectors and Imaging Devices: Infrared, Focal Plane and Single Photon, San Diego, CA -- August 4, 2010
There is a need for semiconductor-based ultraviolet photodetectors to support avalanche gain in order to realize better performance andmore effective compete with existing technologies. Wide bandgap III-Nitride semiconductors are the promising material system for the development of avalanche photodiodes (APDs) that could be a viable alternative to current bulky UV detectors such as photomultiplier tubes. In this paper, we review the current state-of-the-art in IIINitride visible-blind APDs, and present our latest results on GaN APDs grown on both conventional sapphire and low dislocation density free-standing c- and m-plane GaN substrates. Leakage current, gain, and single photon detection efficiency (SPDE) of these APDs were compared. The spectral response and Geiger-mode photon counting performance of UV APDs are studied under low photon fluxes, with single photon detection capabilities as much as 30% being demonstrated in smaller devices. Geiger-mode operation conditions are optimized for enhanced SPDE. reprint
 
15.  
III-nitride based avalanche photo detectors
III-nitride based avalanche photo detectors
R. McClintock, E. Cicek, Z. Vashaei, C. Bayram, M. Razeghi and M. Ulmer
Proceedings, Vol. 7780, p. 77801B, SPIE Optics and Photonics Symposium, Conference on Detectors and Imaging Devices: Infrared, Focal Plane and Single Photon, San Diego, CA -- August 4, 2010
Research into III-Nitride based avalanche photodiodes (APDs) is motivated by the need for high sensitivity ultraviolet (UV) detectors in numerous civilian and military applications. By designing III-Nitride photodetectors that utilize low-noise impact ionization high internal gain can be realized-GaN APDs operating in Geiger mode can achieve gains exceeding 1×107. Thus with careful design, it becomes possible to count photons at the single photon level. In this paper we review the current state of the art in III-Nitride visible-blind APDs and discuss the critical design choices necessary to achieve high performance Geiger mode devices. Other major technical issues associated with the realization of visible-blind Geiger mode APDs are also discussed in detail and future prospects for improving upon the performance of these devices are outlined. The photon detection efficiency, dark count rate, and spectral response of or most recent Geiger-mode GaN APDs on free-standing GaN substrates are studied under low photon fluxes, with single photon detection capabilities being demonstrated. We also present our latest results regarding linear mode gain uniformity: the study of gain uniformity helps reveal the spatial origins of gain so that we can better understand the role of defects. reprint
 
16.  
Geiger-mode operation of ultraviolet avalanche photodiodes grown on sapphire and free-standing GaN substrates
Geiger-mode operation of ultraviolet avalanche photodiodes grown on sapphire and free-standing GaN substrates
E. Cicek, Z. Vashaei, R. McClintock, C. Bayram, and M. Razeghi
Applied Physics Letters, Vol. 96, No. 26, p. 261107 (2010);-- June 28, 2010
GaN avalanche photodiodes (APDs) were grown on both conventional sapphire and low dislocation density free-standing (FS) c-plane GaN substrates. Leakage current, gain, and single photon detection efficiency (SPDE) of these APDs were compared. At a reverse-bias of 70 V, APDs grown on sapphire substrates exhibited a dark current density of 2.7×10−4 A/cm² whereas APDs grown on FS-GaN substrates had a significantly lower dark current density of 2.1×10−6 A/cm². Under linear-mode operation, APDs grown on FS-GaN achieved avalanche gain as high as 14 000. Geiger-mode operation conditions were studied for enhanced SPDE. Under front-illumination the 625 μm² area APD yielded a SPDE of 13% when grown on sapphire substrates compared to more than 24% when grown on FS-GaN. The SPDE of the same APD on sapphire substrate increased to 30% under back-illumination—the FS-GaN APDs were only tested under front illumination due to the thick absorbing GaN substrate. reprint
 
17.  
GaN avalanche photodiodes grown on m-plane freestanding GaN substrate
GaN avalanche photodiodes grown on m-plane freestanding GaN substrate
Z. Vashaei, E. Cicek, C. Bayram, R. McClintock and M. Razeghi
Applied Physics Letters, Vol. 96, No. 20, p. 201908-1-- May 17, 2010
M-plane GaN avalanche p-i-n photodiodes on low dislocation density freestanding m-plane GaN substrates were realized using metal-organic chemical vapor deposition. High quality homoepitaxial m-plane GaN layers were developed; the root-mean-square surface roughness was less than 1 Å and the full-width-at-half-maximum value of the x-ray rocking curve for (1010) diffraction of m-plane GaN epilayer was 32 arcsec. High quality material led to a low reverse-bias dark current of 8.11 pA for 225 μm² mesa photodetectors prior to avalanche breakdown, with the maximum multiplication gain reaching about 8000. reprint
 
18.  
Demonstration of negative differential resistance in GaN/AlN resonant tunneling didoes at room temperature
Demonstration of negative differential resistance in GaN/AlN resonant tunneling didoes at room temperature
Z. Vashaei, C. Bayram and M. Razeghi
Journal of Applied Physics, Vol. 107, No. 8, p. 083505-- April 15, 2010
GaN/AlN resonant tunneling diodes (RTD) were grown by metal-organic chemical vapor deposition (MOCVD) and negative differential resistance with peak-to-valley ratios as high as 2.15 at room temperature was demonstrated. Effect of material quality on RTDs’ performance was investigated by growing RTD structures on AlN, GaN, and lateral epitaxial overgrowth GaN templates. Our results reveal that negative differential resistance characteristics of RTDs are very sensitive to material quality (such as surface roughness) and MOCVD is a suitable technique for III-nitride-based quantum devices. reprint
 
19.  
AlN/GaN double-barrier resonant tunneling diodes grown by metal-organic chemical vapor deposition
AlN/GaN double-barrier resonant tunneling diodes grown by metal-organic chemical vapor deposition
C. Bayram, Z. Vashaei and M. Razeghi
Applied Physics Letters, Vol. 96, No. 4, p. 042103-1-- January 25, 2010
AlN/GaN double-barrier resonant tunneling diodes (RTDs) were grown by metal-organic chemical vapor deposition on sapphire. RTDs were fabricated via standard processing steps. RTDs demonstrate a clear negative differential resistance (NDR) at room temperature (RT). The NDR was observed around 4.7 V with a peak current density of 59 kA/cm² and a peak-to-valley ratio of 1.6 at RT. Dislocation-free material is shown to be the key for the performance of GaN RTDs. reprint
 

Page 1  (19 Items)