Publications by    
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1.  
High brightness ultraviolet light-emitting diodes grown on patterned silicon substrate
High brightness ultraviolet light-emitting diodes grown on patterned silicon substrate
Yoann Robin, Kai Ding, Ilkay Demir, Ryan McClintock, Sezai Elagoz, Manijeh Razeghi
Materials Science in Semiconductor Processing 90, pp. 87–91-- November 5, 2018
We report on the fabrication of high brightness AlGaN-based ultraviolet light emitting diodes (UV-LED) on patterned silicon. Using the lateral epitaxial overgrowth approach, we demonstrate the growth of a 6 μm thick AlN layer of high crystalline quality. X-ray diffraction characterization showed a rocking curve with a full width at half maximum of 553 and 768″ for the (00.2) and (10.2) planes, respectively. The low dislocation density of the AlN template enabled the growth of bright AlGaN/ GaN quantum wells emitting at 336 nm. By appropriate flip-chip bonding and silicon substrate removal processing steps, the patterned AlN surface was exposed and efficient bottom-emission UV-LEDs were realized. Improvement of the AlN quality and the structure design allowed the optical output power to reach the milliwatt range under pulsed current, exceeding the previously reported maximum efficiency. Further investigations of the optical power at different pulsed currents and duty cycles show that thermal management in this device structure is still challenging, especially in continuous wave mode operation. The strategy presented here is of interest, since AlN crystalline quality improvement and optimization of the light extraction are the main issues inhibiting efficient UV emitter on silicon fabrication. reprint
 
2.  
Sandwich method to grow high quality AlN by MOCVD
Sandwich method to grow high quality AlN by MOCVD
Demir , H Li, Y Robin, R McClintock, S Elagoz and M Razeghi
Journal of Physics D: Applied Physics 51, pp. 085104-- February 7, 2018
We report pulsed atomic layer epitaxy growth of a very high crystalline quality, thick (~2 µm) and crack-free AlN material on c-plane sapphire substrates via a sandwich method using metal organic chemical vapor deposition. This sandwich method involves the introduction of a relatively low temperature (1050 °C) 1500 nm thick AlN layer between two 250 nm thick AlN layers which are grown at higher temperature (1170 °C). The surface morphology and crystalline quality remarkably improve using this sandwich method. A 2 µm thick AlN layer was realized with 33 arcsec and 136 arcsec full width at half maximum values for symmetric and asymmetric reflections of ω-scan, respectively, and it has an atomic force microscopy root-mean-square surface roughness of ~0.71 nm for a 5  ×  5 µm² surface area. reprint
 
3.  
Direct growth of thick AlN layers on nanopatterned Si substrates by cantilever epitaxy
Direct growth of thick AlN layers on nanopatterned Si substrates by cantilever epitaxy
Ilkay Demir, Yoann Robin, Ryan McClintock, Sezai Elagoz, Konstantinos Zekentes, and Manijeh Razeghi
Physica Status Solidi 214 (4), pp. 1770120-- April 4, 2017
The growth of thick, high quality, and low stress AlN films on Si substrates is highly desired for a number of applications like the development of micro and nano electromechanical system (MEMS and NEMS) technologies [1] and particularly for fabricating AlGaNbased UV LEDs [2–5]. UV LEDs are attractive as they are applied in many areas, such as biomedical instrumentations and dermatology, curing of industrial resins and inks, air purification, water sterilization, and many others [2, 3]. UV LEDs have been generally fabricated on AlN, GaN, Al2O3, or SiC substrates because of better lattice mismatching to AlGaN material systems. reprint
 
4.  
Direct growth of thick AlN layers on nanopatterned Si substrates by cantilever epitaxy
Direct growth of thick AlN layers on nanopatterned Si substrates by cantilever epitaxy
Ilkay Demir, Yoann Robin, Ryan McClintock, Sezai Elagoz, Konstantinos Zekentes, and Manijeh Razeghi
Phys. Status Solidi A, pp. 1–6-- September 30, 2016
AlN layers have been grown on 200 nm period of nanopatterned Si (111) substrates by cantilever epitaxy and compared with AlN layers grown by maskless lateral epitaxial overgrowth (LEO) on micropatterned Si (111) substrates. The material quality of 5–10 µm thick AlN grown by LEO is comparable to that of much thinner layers (2 µm) grown by cantilever epitaxy on the nanopatterned substrates. Indeed, the latter exhibited root mean square (RMS) roughness of 0.65 nm and X-ray diffraction full width at half-maximum (FWHM) of 710 arcsec along the (0002) reflection and 930 arcsec along the (10̅15) reflection. The corresponding room temperature photoluminescence spectra was dominated by a sharp band edge peak. Back emission ultra violet light emitting diodes (UV LEDs) were fabricated by flip chip bonding to patterned AlN heat sinks followed by complete Si (111) substrate removal demonstrating a peak pulsed power of ∼0.7 mW at 344 nm peak emission wavelength. The demonstrated UV LEDs were fabricated on a cost effective epitaxial structure grown on the nanopatterned Si substrate with a total thickness of 3.3 µm reprint
 

Page 1  (4 Items)